Created on 09.11

The cutting process commonly used in light structures

Nowadays, weight reduction has become an innovation driver in many industries, mainly including automotive technology, aerospace technology, and medical technology. Ultrasonic cutting provides an excellent prerequisite for processing materials that are increasingly used in lightweight structures.
Today, effective cutting of different materials can be achieved through replaceable blades, such as glass fiber or carbon fiber fabrics, foam materials, leather, artificial leather, rubber, cardboard, or paper.
The frequency of ultrasonic waves exceeds the auditory threshold, approximately above 20 kHz. The frequency used for cutting ranges from 20 kHz to 30 kHz. Ultrasonic waves are generated by a piezoelectric transducer that makes the blade vibrate at high frequency. This works extremely effectively in resonance while requiring relatively low power. Therefore, when the environmental thermal load is low, the cut sections are very neat. There is no need to worry about the product adhering to the blade at all. In addition, this process has other advantages, making it particularly suitable for cutting materials used in lightweight structures. Compared with mechanical milling, ultrasonic cutting does not cause any material loss. There is no debris; the cutting edges are smooth and clean, so no trimming is required.
Unlike water jet cutting and similar operations, no cutting medium is needed for ultrasonic cutting. The cut workpiece also remains dry and clean. The cutting depth can be adjusted arbitrarily; besides, ultrasonic cutting produces little noise, so no noise protection measures need to be taken. Furthermore, unlike laser cutting, the surface of the cut workpiece can meet special quality assessment standards—there will be no burnt cutting edges or combustion gases formed. Due to its significantly lower purchase and operation costs compared with other processes, ultrasonic cutting has become a practical process required for many lightweight structure applications.

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